Nantong Fujitsu Microelectronics Co., Ltd. (002156)

Nantong Fujitsu Microelectronics Co., Ltd. (002156)

Tongfu Microelectronics Co., Ltd. was established in October 1997 and listed in Shenzhen Stock Exchange in August 2007 (stock abbreviation: Tongfu microelectronics, stock code: 002156). The total share capital of the company is 1329.0369 million shares. The first largest shareholder is Nantong Huada microelectronics Group Co., Ltd. and the second largest shareholder is national integrated circuit industry investment fund Co., Ltd. the total assets of the company exceed 20 billion yuan.

Tongfu microelectronics is a national key high-tech enterprise, vice chairman unit of China Semiconductor Industry Association, executive vice chairman unit of national IC packaging and testing industry chain technology innovation alliance, and one of China's top 100 electronic information enterprises. The global sealed test enterprises ranked fifth.

Headquartered in Chongchuan District, Nantong, Jiangsu Province, Tongfu Microelectronics Co., Ltd. (Nantong Tongfu), Hefei Tongfu Microelectronics Co., Ltd. (Hefei Tongfu), Suzhou Tongfu Chaowei Semiconductor Co., Ltd. (tf-amd Suzhou), Tongfu Microelectronics Co., Ltd TF amd Microelectronics (Penang) Sdn. Bhd. (tf-amd Penang) and Xiamen Tongfu Microelectronics Co., Ltd. (Xiamen Tongfu) are under construction. Through its own development and M & A, the company has become a local multinational semiconductor group company and a leading enterprise in IC packaging and testing in China, with more than 15000 employees.

Tongfu micro power is the backbone undertaking unit of the national major science and technology project ("02" project). It has a high-level R & D platform, such as national recognized enterprise technology center, National Postdoctoral research workstation, provincial engineering technology research center, provincial academician workstation and Enterprise Research Institute, with a technology management team of more than 2000 people.

Tongfu microelectronics has advanced packaging technology such as bumping, WLCSP, FC, BGA and sip, traditional packaging technology such as QFN, QFP and so, and packaging technology such as automotive electronic products and MEMS; And wafer testing, system testing and other testing technologies. The company takes the lead in realizing the full process mass production of 12 inch 28nm mobile phone processor chips in domestic packaging and testing enterprises, including bumping, CP, FC, FT, SLT, etc. The company's products and technologies are widely used in high-end processor chips (CPU, GPU), memory, information terminals, Internet of things, power modules, automotive electronics and other cloud, tube and terminal fields facing the intelligent era. More than half of the top ten semiconductor manufacturers in the world are customers of the company.

Tongfu microelectronics is the first in the industry to pass ISO9001, ISO / TS16949 and other quality systems. Sap, MES, equipment automation, EDI and other information systems are used to automatically control the production process according to the customer's personalized specifications, and conduct real-time information exchange with customers. Implement the "Tongfu micro electric industry 4.0" project, comprehensively build a smart factory based on the Internet of things, and establish a flexible automation assembly line to achieve win-win results with customers.

Tongfu's development goal is to become a world-class IC packaging and testing enterprise. With the support of national policy and market, the demand traction of system manufacturers, the coordinated development of industrial chain, the support of national industrial fund and national major special projects, Tongfu micro power will continue to move towards the goal of international IC packaging and testing enterprises.

>> tungsten carbide mens rings