Tianshui Huatian Technology Co., Ltd. (002185)

Tianshui Huatian Technology Co., Ltd. (002185)

Tianshui Huatian Technology Co., Ltd. was established on December 25, 2003, and was listed and traded on Shenzhen Stock Exchange on November 20th, 2007. Stock abbreviation: Huatian technology; Stock Code: 002185. At present, the total share capital of the company is 2131112900 shares, and the registered capital is 2131112900 yuan.

The company mainly engaged in semiconductor integrated circuit packaging and testing business. At present, the integrated circuit packaging products of the company mainly include dip/sdip, sot, SOP, SSOP, tssop/etssop, qfp/lqfp/tqfp, qfn/dfn, bga/lga, FC, MCM (MCP), sip, WLP, TSV, bumping, MEMS and other series. The products are mainly used in computer, network communication, consumer electronics and intelligent mobile terminals, Internet of things, industrial automation control, automotive electronics and other electronic complete machines and intelligent devices The field of energy. The annual package scale and sales revenue of IC are ranked second in the listed companies in the same industry in China.

In recent years, the company has continuously strengthened the research and development of advanced packaging technology and products, increased R & D investment, improved the R & D simulation platform construction with Huatian Xi'an as the main body, relying on the R & D and verification platforms such as national enterprise technology center, Gansu Microelectronics Engineering Technology Research Center, Gansu micro electronics engineering laboratory and other R & D verification platforms, and implemented the 02 special science and technology major special projects of the state The technology innovation project and the continuous research and development of new products, new technologies and new processes have independently developed many advanced integrated circuit packaging technologies and products such as FC, bumping, MEMS, MCM (MCP), WLP, sip, TSV, fan out, etc. with the company further increasing the technological innovation, the company's technical competitive advantage will be improved.

The company has a stable customer group and a strong sales network, has been widely trusted by customers, and has established a long-term good cooperation relationship. In recent years, the company has steadily expanded its domestic market, and through measures such as increasing the development of international market and overseas M & A, it has effectively expanded the international market, and has formed a global distribution sales pattern, which provides strong market guarantee for the development of the company and reduces market risk.

Over the years, the company has been expanding the industrial scale and rapidly improving the technical level. Meanwhile, through continuous technological and management innovation, the company has maintained healthy and sustained rapid development, and the economic benefits of the company have been at the leading level in the listed companies in the same industry in China. The company has a good management team, dare to manage, dare to develop and innovate, unite and upward; the corporate governance structure is perfect, and all management systems are complete; for many years of large production practice, the company has formed an advanced large production management system.

The company will adhere to the theme of development, take science and technology innovation as the driving force, take product structure adjustment as the main line, advocate management innovation, product innovation and service innovation, expand and improve the scale and level of existing integrated circuit packaging business, and vigorously develop high-end packaging technologies and products such as BGA, MCM (MCP), sip, FC, TSV, MEMS, bumping, fan out, WLP, etc., and expand the company In the business field, we should improve the technical content and market added value of core business, and strive to improve market share and profitability.

While accelerating its rapid development, the company effectively implements the merger and acquisition and equity acquisition. Through merger and reorganization and resource integration, the company continuously improves the industrial development layout, steadily promotes the internationalization process of the company, with a view to achieving leapfrog development, developing the company into an internationally renowned integrated circuit packaging testing enterprise, and building the integrated circuit packaging and testing industry in China First brand.

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