Semiexpo Shenzhen 2021

Time: 2021 / 7 / 28 --- 2021 / 7 / 30

Exhibition hall: Shenzhen Convention and Exhibition Center

The opportunity and growth of semiconductor industry will come from the emerging application market, which is shifting from the global semiconductor industry to the Chinese mainland. The investment scale will exceed 170 billion US dollars in the next ten years. Chinese mainland will become the largest market of semiconductor materials and equipment.

This exhibition is in line with the trend of industrial development and serves more than a dozen applications in emerging industries. This exhibition is a semiconductor industry chain exhibition integrating chip design and manufacturing, integrated circuit, packaging and testing, materials and equipment. It is committed to promoting future new applications and cooperation and exchanges with global AI, Internet of things, automobile, mobile phone, 3C electronics and semiconductor industry chain. The exhibition area of semiexpo Shenzhen 2020 is 40000 square meters, with 503 enterprises participating in the exhibition and 36000 professional visitors, including more than 6000 people. It is one of the best platforms for semiconductor industry chain or professionals who are about to enter the industry to observe and negotiate.

1. Solution Chip Application Exhibition Area

Artificial intelligence chip and solution, Internet of things chip, 6G communication chip and solution, artificial intelligence, 5g, Internet of things, intelligent car, intelligent sensor, photoelectric industry, automatic driving, intelligent medical treatment, VR / AR, wireless charging, fingerprint under screen, biological identification, industrial Internet, intelligent factory, etc;

2. Material exhibition area

Silicon wafer, silicon wafer, photoresist, photomask, electron gas, and special chemical gas, CMP polishing materials, photoresist materials, wet electronic chemicals, sputtering targets, sealing materials

3. Semiconductor and terminal application brand exhibition area

5g mobile phone, smart TV, smart wearable, UAV, driverless, wireless charging, smart Internet of things, smart security, smart city, smart home, smart touch, etc

4. Equipment exhibition area

Thinning machine, dicing machine, placement machine, welding machine, plastic packaging machine, bending equipment, sorting machine, testing machine, robot automation, machine vision, other materials and electronic special equipment, etc;

Single crystal furnace, oxidation furnace, diffusion equipment, ion implantation equipment, PVD, CVD, lithography machine, etching machine, polishing machine, chamfering machine, gluing / developing machine, front test equipment, wet process equipment, thermal processing, coating equipment, single crystal deposition system, cleaning equipment

5.5G Communication Exhibition Area

Scheme, equipment, components, new materials and Application

6. Packaging and testing supporting exhibition area

Probe card, lead stitching, welding test, automatic test, laser cutting and others, grinding fluid, dicing fluid, sealing film (adhesive) high temperature tape, laminated substrate, mounting adhesive, feeding plate, welding line flow control, quartz graphite, silicon carbide